MRO Magazine

Research and Markets: Global Die-level Packaging Equipment Market Will Grow at a CAGR of 1.24% During 2014-2019, New Report Says

August 26, 2015 | By Business Wire News

DUBLIN

Research and Markets (http://www.researchandmarkets.com/research/9h8j6q/global_dielevel) has announced the addition of the “Global Die-level Packaging Equipment Market 2015-2019” report to their offering.

The short replacement cycle of portable electronic devices is a key trend observed in this market. Frequent launches of next-version models render the current portable devices obsolete within a short period of time. This short lifespan will augment the demand for semiconductor wafers during the forecast period.

According to the report, steady growth of semiconductor wafer industry is a major driver that promotes growth in this market. The demand for semiconductor wafers is continually increasing owing to the augmented demand for portable electronic devices globally. Steady growth of semiconductor wafer industry

Further, the report states that the increasing dependency on few key suppliers is a major challenge faced by this market. Inability of the raw material suppliers to provide resources on time negatively affects the business of semiconductor die-level packaging equipment manufacturers.

Key Topics Covered

  1. Executive Summary
  2. List of Abbreviations
  3. Scope of the Report
  4. Market Research Methodology
  5. Introduction
  6. Industry Overview
  7. Market Landscape
  8. Geographical Segmentation
  9. Buying Criteria
  10. Market Growth Drivers
  11. Drivers and Their Impact
  12. Market Challenges
  13. Impact of Drivers and Challenges
  14. Market Trends
  15. Trends and Their Impact
  16. Vendor Landscape

Companies Mentioned

  • Advantest
  • ASM International NV
  • BE Semiconductor Industries N.V. (Besi)
  • Cohu
  • DISCO Corp.
  • Hitachi High-Technologies.
  • Kulicke & Soffa Industries
  • Shinkawa
  • TOWA

For more information visithttp://www.researchandmarkets.com/research/9h8j6q/global_dielevel

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
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Sector: Packaging

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