Research and Markets: Global 3D IC Market 2015-2019 – High Proliferation of IoT Devices to Boost Market Growth

DUBLIN

Research and Markets (http://www.researchandmarkets.com/research/3dv3vf/global_3d_ic) has announced the addition of the “Global 3D IC Market 2015-2019” report to their offering.

The global 3D IC market is projected to grow at a CAGR above 79% during the forecast period.

The demand for compact and high-performance ICs in smartphones, tablet PCs, smart TVs, automotive products, and heavy equipment is the primary growth driver for this market. In comparison to 2D ICs, they have better performance and high bandwidth. Moreover, 3D ICs have a lesser number of interconnections between the packages, consumes less power, and require less space on electronic boards.

The high proliferation of IoT devices is expected to boost the market growth during the forecast period. Vendors in IoT market are constantly innovating in designing, manufacturing, and packaging. This enables them to come up with new IoT products in different verticals such as consumer electronics, healthcare, and manufacturing.

3D MEMS and sensors are used to capture data in a real-time scenario, which helps the company in increasing the returns by streamlining the process, increasing productivity, and enabling predictive maintenance. They also reduce the maintenance cost and the possibility of a sudden stop of work due to machinery failure.

APAC accounted for 52% of the market share during 2014 and is expected to grow at a CAGR of 86% during the forecast period. The high growth in memory product segment and presence of several prominent manufacturers in the mobile and consumer electronics market.

Companies Mentioned:

• Advanced Semiconductor Engineering (ASE)
• Samsung
• STMicroelectronics
• Taiwan Semiconductors Manufacturing (TSMC)
• Toshiba
• Intel
• Micron
• SanDisk
• SK Hynix
• STATS ChipPAC
• United Microelectronics
• Xilinx.

Key Topics Covered:

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Market research methodology

PART 04: Introduction

PART 05: Market landscape

PART 06: Market segmentation by product types

PART 07: Geographical segmentation

PART 08: Market drivers

PART 09: Market challenges

PART 10: Impact of drivers and challenges

PART 11: Market trends

PART 12: Vendor landscape

PART 13: Key vendor analysis

For more information visit http://www.researchandmarkets.com/research/3dv3vf/global_3d_ic

View source version on businesswire.com: http://www.businesswire.com/news/home/20151221005524/en/

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