Research and Markets: CMP Technology 2015 Competition, Products and Markets – Examines and Projects the Technologies Involved in the Planarization of Semiconductor Layers
August 20, 2015 | By Business Wire News
DUBLIN
Research and Markets (http://www.researchandmarkets.com/research/6p8x9w/cmp_technology) has announced the addition of the “CMP Technology: Competition, Products, Markets” report to their offering.
Chemical mechanical planarization (CMP) is a very important process in semiconductor manufacturing. The combination of mechanical abrasion and chemical etching enable polishing and flattening of wafers before the photolithography stage. This helps in avoiding the depth of field issues during illumination.
This technology-marketing report examines and projects the technologies involved in the planarization of semiconductor layers. The emphasis is on Chemical Mechanical Polishing (CMP).
This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for CMP equipment and materials and market shares of vendors is presented.
Key Topics Covered:
Chapter 1 Introduction
Chapter 2 Executive Summary
Chapter 3 Planarization Methods
Chapter 4 CMP Consumables
Chapter 5 CMP Equipment
Chapter 6 User Issues
Chapter 7 Market Forecast
For more information visit http://www.researchandmarkets.com/research/6p8x9w/cmp_technology
View source version on businesswire.com: http://www.businesswire.com/news/home/20150820005501/en/
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