MRO Magazine

Research and Markets: CMP Technology 2015 Competition, Products and Markets – Examines and Projects the Technologies Involved in the Planarization of Semiconductor Layers

By Business Wire News   


Research and Markets ( has announced the addition of the “CMP Technology: Competition, Products, Markets” report to their offering.

Chemical mechanical planarization (CMP) is a very important process in semiconductor manufacturing. The combination of mechanical abrasion and chemical etching enable polishing and flattening of wafers before the photolithography stage. This helps in avoiding the depth of field issues during illumination.

This technology-marketing report examines and projects the technologies involved in the planarization of semiconductor layers. The emphasis is on Chemical Mechanical Polishing (CMP).

This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for CMP equipment and materials and market shares of vendors is presented.

Key Topics Covered:

Chapter 1 Introduction

Chapter 2 Executive Summary

Chapter 3 Planarization Methods

Chapter 4 CMP Consumables

Chapter 5 CMP Equipment

Chapter 6 User Issues

Chapter 7 Market Forecast

For more information visit

Research and Markets
Laura Wood, Senior Manager
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Computing and Technology


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