Photo Stencil Presents Stencil Design Research at SMTA Rocky Mountain Chapter’s May 13th Event
By Business Wire News
By Business Wire News
COLORADO SPRINGS, Colo.
Photo Stencil, LLC, a leading full-service provider of high-performance stencils and tooling, announces that Dr. Bill Coleman, vice president technology, Photo Stencil, will present research and information on Stencil Design at the PCBA 101: Step 1 – Solder Paste Printing event sponsored by the SMTA Rocky Mountain Chapter. The event is being held on May 13, 2015 at Blackfox in Longmont, Colorado from 9:00 am–3:00 pm.
“Stencil designs come in various configurations and styles depending upon the type and pitch of the components being assembled,” explained Dr. Coleman. “Aperture design is only part of the stencil design. When there is a mix of SMD devices such as small pitch/large pitch and large discrete devices, it is difficult to satisfy the paste volume requirements with a single thickness stencil.”
Dr. Coleman has been providing his experience and knowledge to the electronic interconnect industry for over 30 years. He is the holder of the prestigious IPC President’s Award and is a 3-time winner of IPC’s Committee Service Award. Among his contributions, he was instrumental in establishing the standard IPC-7525 Stencil Design Guidelines and was the original chair of IPC’s 5-21eSolder Stencil Task Group Committee. Coleman has numerous patents and serves on university and industry boards of directors. He received a PhD in physics from West Virginia University.
The event is open to quality, manufacturing, design, and process engineers, engineering managers, buyers, and engineering students. PCBA 101 will address critical issues to consider for defect free and reliable solder paste printing.
Photo available at http://www.photostencil.com/images/business-after-hours.jpg
About Photo Stencil
Photo Stencil, LLC provides high-performance stencils, squeegee blades, thick film and metal mask screens, and tooling for the surface mount technology (SMT) assembly, solar, and semiconductor industries. Its innovations include the patented AMTX E-FAB®electroformed stencils, high-performance, proprietary NicAlloy™, NicAlloy-XT™, laser-cut, and chemetch stencils, and patented electroformed E-Blade®squeegee blade. Stencil design support and customer-specific design libraries are also provided. Founded in 1979, Photo Stencil is headquartered in Colorado Springs and has a manufacturing facility in Mexico. For more information, follow us on www.Linkedin.com/company/Photo-Stencil-llc, visit www.photostencil.com, or email email@example.com.