Harwin EZ-Shield Cans Development Kit Wins ECN IMPACT Award
May 28, 2015 | By Business Wire News
Harwin, the leading hi-rel connector and SMT board hardware manufacturer, has won the Tools, Kits & Reference Designs category in the prestigious 2015 ECN IMPACT Awards for its EZ-Shield Cans Development Kit. The winners were announced at a glittering ceremony held on May 13 at the Mirage in Las Vegas.
Harwin’s EZ-Shield Cans Development Kit provides an easy yet elegant method for design engineers to rapidly construct PCB cans which provide EMI/RFI screening for sensitive electronic circuits during the development phase of a project. Typically during development and test, engineers have to order bespoke shield cans, without being certain of their eventual requirements. This incurs costs and creates delays. Harwin’s EZ-Shield Can Kit enables designers to create an EZ-Shield Can of the dimensions required in minutes, at minimal cost, with no special tools or prior experience. The nickel silver material provides effective and useable shielding with up to 24dB attenuation achieved, depending on frequency and configuration. The kit saves time and money, can shorten the development stage of the design cycle and helps to ensure that the optimal EMC solution is found.
Product Manager, Paul Gillam said: “We are delighted to win this Award, particularly against many notable and worthy competitors. Our EZ-Shield Can Kit complements our EZ-BoardWare range of EMC solutions and enables both design and production engineers to achieve a timely, cost-effective solution to EMI/RFI shielding.”
The low cost kits comprise two 80mm x 60mm x 0.3mm thick Nickel Silver sheets that are pre-scribed on a 5mm grid to allowing easy cutting and forming, enabling the user to produce a shield can of the desired dimensions. EZ-Shield Can Clips which hold the cans securely in place are also included. For more information, please visit: https://www.harwin.com/connector-products/featured/ez-shield-can-kit/