MRO Magazine

Vincotech’s New Mid-Power VINco E3 Out Now

May 10, 2016
By Business Wire News


Vincotech, a supplier of module-based solutions for power electronics, today announced the launch of a new industry-standard low-profile package for mid-power inverters. Engineered mainly for industrial drives, solar power and UPS applications, the VINco E3 package raises the performance bar with its enhanced power density and reliability.

VINco E3 features SLC (SoLid Cover) technology, which combines an insulated metal baseplate and direct potting resin to achieve both high thermal and high power cycling capability. Equipped with the latest low-loss Mitsubishi gen 7 chips, this package also achieves high power density.

The new VINco E3 line’s first release is the VINcoDUAL E3 half-bridge, with sixpack and PIM configurations to follow.

First engineering samples may be sourced on demand from our usual channels.

To see Vincotech’s entire range of power modules, please visit:

Vincotech is a registered trademark of Vincotech Holdings S.à.r.l.


Vincotech – an affiliated company within the Mitsubishi Electric Corporation – develops and manufactures subsystems and electronic components and provides manufacturing services that help customers master complex challenges in electronics integration. Vincotech’s extensive portfolio encompasses standard and tailored solutions, engineering services, and technical support for customers worldwide. These products and services contribute to sustainable, environmentally sound solutions that help modern society embrace mega-trends and explore new avenues.

With approximately 500 employees worldwide, backed by vast experience and a long history in electronics integration, Vincotech leverages these assets to help customers achieve maximum market success.

To learn more about Vincotech, please visit

Product Contact:
Dr. Evangelos Theodossiu, +49 (0)89 878067-149
Media Contact:
Karina Seifert, +49 (0)89 878067-115