MRO Magazine

Thin Wafer Market by Wafer Size, Application and Region – Global Trend and Forecast to 2022 – Research and Markets

February 1, 2016 | By Business Wire News

DUBLIN

Research and Markets (http://www.researchandmarkets.com/research/nr2z3n/thin_wafer_market) has announced the addition of the “Thin Wafer Market by Wafer Size (125mm, 200mm, 300mm), Application (MEMS, CMOS Image Sensor, Memory, RF Devices, LEDs, Interposers, and Logic), and Region – Global Trend and Forecast to 2022” report to their offering.

The thin wafer market was valued at 6.76 Billion in 2015, and is estimated to reach USD 9.17 Billion by 2022 with a CAGR of 3.7% between 2016 and 2022.

The increasing demand for semiconductor devices in several industries such as automotive, consumer electronics, and telecommunication among many others impacts the market positively. Thin wafers have applications LEDs, MEMS, CIS, power devices, RF devices, memory, and other semiconductor devices; the impressive growth of this market can be attributed to these applications. Also the growing IC industry and high adoption of portable devices are creating opportunities for thin wafers, worldwide.

The 300mm wafer is the fastest-growing segment in the thin wafer market. The 300mm wafer offers the ability to manufacture a large number of devices in a single batch. This is one of the reasons companies are developing their semiconductor devices on this wafer. Infineon Technologies (Germany) started developing its power semiconductor devices on this wafer in 2011.

APAC accounts for the largest market share and is expected to grow at the highest CAGR during the forecast period. The development of semiconductor devices in economies such as China, South Korea, and Taiwan among many others drives the market in this region. Cheap labor cost and high demand of consumer electronic devices are also driving the thin wafer market in the region. Many companies are investing in APAC and developing devices in the region because of favorable economic conditions.

One of the key restraining factors in the thin wafer market is efficiency maintenance. A thin wafer has a low light absorption capacity for a long wavelength, especially if the thickness is below 50ìm. This inability to absorb the long wavelength of a thin wafer impacts its efficiency. Also, delays in supply of thin wafers due to manufacturing defects can cause additional losses in the form of order cancellations and shift of the customers to other suppliers.

Key players in this market are focused on mergers & acquisitions and new product launches to increase their revenue. Shin-Etsu Chemical Co., Ltd. is one of the leaders in the thin wafer market. The company adopted mergers & acquisitions as a key strategy to cater a large number of customers and increase its revenue in the thin wafer market. In recent years, the company acquired Asia Silicones Monomer Limited (Thailand). The acquisition helped the company cater to a large number of manufacturers and increase its sales for silicon end products in other Asian countries.

Key Topics Covered:

1 Introduction

2 Research Methodology

3 Executive Summary

4 Premium Insights

5 Market Overview

6 Industry Trend

7 Thin Wafer Handling Market, By Process

8 Thin Wafer Market, By Wafer Size

9 Thin Wafer Market, By Application

10 Thin Wafer Market, By Geography

11 Competitive Landscape

12 Company Profiles

– 3M

– Applied Materials, Inc.

– Brewer Science Inc.

– Disco Corporation

– EV Group

– LG Siltron Inc.

– Lintec Corporation

– Mechatronik Systemtechnik GmbH.

– Nissan Chemical Corporation

– Shin-Etsu Chemical Co., Ltd.

– Siltronic AG

– Sumco Corporation

– Sunedison Semiconductor Ltd.

– Synova

– Süss Micro Tec AG

– ULVAC GmbH

For more information visit http://www.researchandmarkets.com/research/nr2z3n/thin_wafer_market

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
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