Research and Markets: Semiconductor Packaging and Test Market in China to Grow by 7.05% CAGR over Five Years – Analysis & Forecast 2015-2019
December 7, 2015 | By Business Wire News
DUBLIN
Research and Markets (http://www.researchandmarkets.com/research/zgrtc8/semiconductor) has announced the addition of the “Semiconductor Packaging and Test Market in China 2015-2019” report to their offering.
The report forecasts the semiconductor packaging and test market in China to grow at a CAGR of 7.05% by revenue over the period 2014-2019. The report, Semiconductor Packaging and Test Market in China in 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report focuses on the landscape of semiconductor packaging and test market in China market and its opportunities in the coming years. The report includes a discussion of the key vendors operating in this market.
Key Topics Covered:
The report covers the present scenario and the growth prospects of the semiconductor packaging and test market in China for 2015-2019 along with a market overview. The market has been segmented and sub-segmented on the following basis:
- IDM (integrated devices manufacturers)
- Outsourced semiconductor assembly and test (OSAT)
Questions Answered:
- What will the market size be in 2019 in terms of both revenue and unit shipments and what will the growth rate be?
- What are the key Market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
Companies Mentioned:
- Amkor Technology
- ASE
- Powertech Technology
- Siliconware Precision Industries (SPIL)
- STATS ChipPAC
- UTAC
- ChipMos
- Greatek
- Huahong
- JCET
- KYEC
- Lingsen Precision
- Nepes
- SMIC
- Tianshui Huatian
- Unisem
Report Structure
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Market research methodology
PART 04: Introduction
PART 05: Market landscape
PART 06: Market segmentation by business type
PART 07: Market drivers
PART 08: Impact of drivers
PART 09: Market challenges
PART 10: Impact of drivers and challenges
PART 11: Market trends
PART 12: Vendor landscape
PART 13: Key vendor analysis
PART 14: Appendix
PART 15: About the Author
For more information visit http://www.researchandmarkets.com/research/zgrtc8/semiconductor
View source version on businesswire.com: http://www.businesswire.com/news/home/20151207005529/en/
Research and Markets
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Sector: Semiconductor