Research and Markets: Samsung Galaxy S6 Teardown & Physical Analyses of Key Components – Reverse Technology Report
November 2, 2015 | By Business Wire News
DUBLIN
Research and Markets (http://www.researchandmarkets.com/research/52jvzl/samsung_galaxy_s6) has announced the addition of the “Samsung Galaxy S6 Teardown & Physical Analyses of Key Components – Reverse Technology Report” report to their offering.
The Samsung Galaxy S6 holds many IC components which are listed and reviewed in the report. A special focus has been made to highlight the component structure and understand the manufacturing process on 11 notable components among 4 selected topics: Advanced packaging, MEMS/Sensor, RF and Imaging.
Five MEMS/Sensors components
- Fingerprint sensor – second generation
- eCompass – new reference which has never been used in a smartphone and smallest eCompass on the market
- OIS gyroscope – smallest gyroscope on the market
- Heart-rate monitor sensor and color, ambient light and proximity sensor – rarely integrated in a smartphone
Imaging components
- Front and rear camera modules as well as flash LED
Two packaging components
- Samsung Exynos Processor – advanced Package-on-Package (PoP) structure
- Samsung power management IC – smallest pitch Wafer-Level Package (WLP) on the board
One RF component
- Wi-Fi & Bluetooth combo module – flip-chip BGA SiP integrating the industry’s most powerful 5G WiFi combo chip
Key Topics Covered:
1. Executive Summary
– High Resolution Pictures
– ICs Identification
– ICs Identification (mfr., ref., fcn., pkg. type, size & pin count)
– Unknown Components Decapsulation
– Repartition by package type
– Mfr. Design wins ranking
– ICs footprint ranking
– PCB Characteristics
– PCB Cross-Section
– PCB min. line width
2. Advanced Packaging
– Samsung Exynos PoP
– Package views & dimensions
– Package Cross-Section
– Package Opening
– Processor & DRAM dies measurement
– Samsung smallest pitch WLP
– Package views & dimensions
– Package Cross-Section
3. MEMS/Sensors
– Fingerprint Sensor
– Button Assembly View
– Fingerprint sensor views & dimensions
– Fingerprint sensor Cross-Section
– Sensor die measurement
– 3-Axis eCompass
– Package views & dimensions
– Package Cross-Section
– Die measurement
– Sensor Details
– OIS Gyroscope
– Assembly in camera module
– Package views & dimensions
– Package Opening & Die measurement
– MEMS opening & sensor details
– Cross-Section
– Pulse Oximetry & Heart-Rate Monitor Sensor
– Package views & dimensions
– Package Opening & Die measurement
– Color, ALS and Proximity Sensor
– Package views & dimensions
– Package Opening & Dies measurement
4. RF Devices
– 5G Wi-Fi & Bluetooth Combo Chip
– Package views & dimensions
– Package Opening & Dies measurement
5. Camera Modules & Flash LED
– 16Mp Rear Camera Module
– Module views & dimensions
– Module Opening & CIS die measurement
– Module Cross-Section
– 5Mp Front Camera Module
– Module views & dimensions
– Module Opening & CIS die measurement
– Module Cross-Section
– Flash LED
– Package views & dimensions
– Package Opening & LED die measurement
For more information visit http://www.researchandmarkets.com/research/52jvzl/samsung_galaxy_s6.
View source version on businesswire.com: http://www.businesswire.com/news/home/20151102006613/en/
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