MRO Magazine

Research and Markets: Samsung Galaxy S6 Teardown & Physical Analyses of Key Components – Reverse Technology Report


November 2, 2015
By Business Wire News

DUBLIN

Research and Markets (http://www.researchandmarkets.com/research/52jvzl/samsung_galaxy_s6) has announced the addition of the “Samsung Galaxy S6 Teardown & Physical Analyses of Key Components – Reverse Technology Report” report to their offering.

The Samsung Galaxy S6 holds many IC components which are listed and reviewed in the report. A special focus has been made to highlight the component structure and understand the manufacturing process on 11 notable components among 4 selected topics: Advanced packaging, MEMS/Sensor, RF and Imaging.

Five MEMS/Sensors components

  • Fingerprint sensor – second generation
  • eCompass – new reference which has never been used in a smartphone and smallest eCompass on the market
  • OIS gyroscope – smallest gyroscope on the market
  • Heart-rate monitor sensor and color, ambient light and proximity sensor – rarely integrated in a smartphone

Imaging components

  • Front and rear camera modules as well as flash LED

Two packaging components

  • Samsung Exynos Processor – advanced Package-on-Package (PoP) structure
  • Samsung power management IC – smallest pitch Wafer-Level Package (WLP) on the board

One RF component

  • Wi-Fi & Bluetooth combo module – flip-chip BGA SiP integrating the industry’s most powerful 5G WiFi combo chip

Key Topics Covered:

1. Executive Summary

– High Resolution Pictures

– ICs Identification

– ICs Identification (mfr., ref., fcn., pkg. type, size & pin count)

– Unknown Components Decapsulation

– Repartition by package type

– Mfr. Design wins ranking

– ICs footprint ranking

– PCB Characteristics

– PCB Cross-Section

– PCB min. line width

2. Advanced Packaging

– Samsung Exynos PoP

– Package views & dimensions

– Package Cross-Section

– Package Opening

– Processor & DRAM dies measurement

– Samsung smallest pitch WLP

– Package views & dimensions

– Package Cross-Section

3. MEMS/Sensors

– Fingerprint Sensor

– Button Assembly View

– Fingerprint sensor views & dimensions

– Fingerprint sensor Cross-Section

– Sensor die measurement

– 3-Axis eCompass

– Package views & dimensions

– Package Cross-Section

– Die measurement

– Sensor Details

– OIS Gyroscope

– Assembly in camera module

– Package views & dimensions

– Package Opening & Die measurement

– MEMS opening & sensor details

– Cross-Section

– Pulse Oximetry & Heart-Rate Monitor Sensor

– Package views & dimensions

– Package Opening & Die measurement

– Color, ALS and Proximity Sensor

– Package views & dimensions

– Package Opening & Dies measurement

4. RF Devices

– 5G Wi-Fi & Bluetooth Combo Chip

– Package views & dimensions

– Package Opening & Dies measurement

5. Camera Modules & Flash LED

– 16Mp Rear Camera Module

– Module views & dimensions

– Module Opening & CIS die measurement

– Module Cross-Section

– 5Mp Front Camera Module

– Module views & dimensions

– Module Opening & CIS die measurement

– Module Cross-Section

– Flash LED

– Package views & dimensions

– Package Opening & LED die measurement

For more information visit http://www.researchandmarkets.com/research/52jvzl/samsung_galaxy_s6.

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
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