MRO Magazine

Research and Markets: iPhone 6s Plus Fingerprint Sensor – Reverse Costing Analysis

December 23, 2015
By Business Wire News


Research and Markets ( has announced the addition of the “iPhone 6s Plus Fingerprint Sensor – Reverse Costing Analysis” report to their offering.

With the iPhone 6s Plus, Apple introduces a new fingerprint sensor. The new device has the same structure and capacitive technology than the previous one, but with important innovations in term of sensor design, die process and packaging.

Integrated in the home button, the 12.5×10.9 mm sensor is incorporated within a rectangular shaped housing composed of a stainless steel ring and an aluminum base. The sensor is protected by a sapphire window coated with two different materials and supported by innovative assembly of dies and flex PCB.

The fingerprint sensor allows it to scan the fingerprint just by pushing the button. The sensor has a resolution of 10,752 pixels with a pixel density of 500ppi. It uses a capacitive touch technology to take an image of the fingerprint from the subepidermal layers of the skin.

Respect to the old fingerprint sensor, the new sensor is composed of two dies, one dedicated to the sensing and one containing the logic. The ASIC die has a 0.18µm manufacturing process and the sensor die is manufactured with a more recent CMOS 65nm technology. While in the previous sensor had edge cavities for the wire bonding; the new sensor is implemented with TSV which allow a better packaging and wire bonding to the flex PCB.

The report includes comparisons with iPhone 5s fingerprint sensor and with the latest Samsung’s and Huawei’s fingerprints buttons.

Key Topics Covered:

1. Introduction

2. Company Profile & Supply Chain

3. Physical Analysis

  • Physical Analysis Methodology
  • Fingerprint Button assembly
  • Home Button Assembly Views
  • Gasket & Flex PCB Removed
  • Fingerprint Sensor
  • Home Button Cross-Section
  • Sensor Die
  • Sensor Die View, Dimensions & Marking
  • Sensor Die Capacitors
  • Sensor Die Delayering
  • Sensor Die Bonding & TSV
  • Sensor Die Process
  • Sensor Cross-Section (Metal Layers, TSV)
  • ASIC Die
  • Dimensions & Markings
  • Delayering
  • IC Process
  • Die Cross-Section

4. Technology and Cost comparison with iPhone 5s fingerprint sensor

5. Manufacturing Process Flow

  • Global Overview
  • Sensor Front-End & TSV
  • Sensor 3D Packaging Process Flow
  • Sensor ASIC Process
  • Sensor Packaging Process
  • Fabrication Units

6. Cost Analysis

  • Sensor Front-End, TSV & 3D Packaging Cost
  • Sensor Back-End 0
  • Sensor Wafer Cost
  • Sensor Die Cost
  • ASIC Front-End & Back-End 0
  • ASIC Wafer Cost
  • ASIC Die Cost
  • Sapphire Window Cost
  • Component Cost & Price

For more information visit

Research and Markets
Laura Wood, Senior Manager
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Sector: Computing and Technology