MRO Magazine

Research and Markets: IC Packaging Market in Taiwan 2015-2019 – Rise in Demand for Smartphones and Tablets a Major Market Driver


September 16, 2015
By Business Wire News

DUBLIN

Research and Markets (http://www.researchandmarkets.com/research/367zv8/ic_packaging) has announced the addition of the “IC Packaging Market in Taiwan 2015-2019” report to their offering.

The IC packaging market in Taiwan to grow at a CAGR of 2.5% over the period 2014-2019.

This report covers the present and future scenarios of the IC packaging market in Taiwan for the period 2015-2019. The author uses 2014 as the base year and provides data for the 12 trailing months. To calculate market size, analysts considered the revenue generated by IC packaging vendors in Taiwan. The ICs from both domestic semiconductor and global semiconductor packaging companies were considered for calculating the market size.

Portable electronic devices such as smartphones and tablets become obsolete after a short time. This is because of rapid launches of next-version models by vendors. The duration of the replacement-cycle period, on average, is 8-12 months. In the past, the replacement period was much longer. Because of the reduction in product-replacement-cycle time, the demand for semiconductor ICs in newly launched devices is expected to rise drastically, and this will increase the demand for IC packaging, leading to the growth of the market.

According to the report, the availability of low-cost smartphones in Taiwan and increased access to the internet are expected to increase the shipments of smartphones and tablets during the forecast period. With the increasing functionality of smartphones and tablets coupled with the growing LTE infrastructure, consumers are demanding these devices at a higher rate. Semiconductor ICs, an integral part of such devices, will undergo a similar rise in demand, leading to market growth during the forecast period.

Further, the report states that the market requires high capital investment, which is a major challenge for its growth.

Key Vendors

– Advanced Semiconductor Engineering

– Powertech Technology

– Siliconware Precision Industries

Other Prominent Vendors

– Amkor Technology

– ChipMOS Technologies

– Greatek Electronics

– King Yuan ELECTRONICS

– Orient Semiconductor Electronics

– STATS ChipPAC

– UTAC

For more information visit http://www.researchandmarkets.com/research/367zv8/ic_packaging

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
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