MRO Magazine

Research and Markets: High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends 2015


May 6, 2015
By Business Wire News

DUBLIN

Research and Markets (http://www.researchandmarkets.com/research/c6m9jj/highdensity) has announced the addition of the “High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends” report to their offering.

High-density packaging offer a host of benefits including performance improvements such as shorter interconnect lengths between die, resulting in reduced time of flight, lower power supply inductance, lower capacitance loading, less cross talk and lower off-chip driver power.

This report examines and projects the technologies involved, their likely developments, what problems and choices are facing users, and where the opportunities and pitfalls are.

Key Topics Covered:

Chapter 1 Introduction

Chapter 2 Executive Summary

2.1 Summary of Technology Issues

2.2 Summary of Market Forecasts

Chapter 3 Technology Issues and Trends

3.1 Overview of HDP Technology

3.2 Technical Constraints of Integration

3.3 Economic Benefits of HDP

3.4 Technology Issues

3.5 3-D Modules

3.6 Superconducting Interconnects

3.7 Known Good Die

3.8 System In Package (SIP)

3.9 Multichip Package

3.10 Package-On-Package (PoP)

Chapter 4 Applications

4.1 Overview of HDP Applications

4.2 Military and Aerospace

4.3 Computer and Peripheral Equipment

4.4 Communications

4.5 Consumer

4.6 Industrial

Chapter 5 Competitive Environment

5.1 Overview of the HDP Competitive Environment

5.2 Joint Ventures and Cooperative Agreements

5.3 HDP Manufacturers

Chapter 6 3-D-TSV Technology

6.1 Driving Forces In 3D-TSV

6.2 3-D Package Varieties

6.3 TSV Processes

6.4 Critical Processing Technologies

6.5 Applications

6.6 Limitations Of 3-D Packaging Technology

6.7 Company Profiles

Chapter 7 Market Forecast

7.1 Overview of Multichip Modules

7.2 Driving Forces

7.3 Alternative Packaging Technologies

7.4 Worldwide IC Market Forecast

7.5 Worldwide Packaging Market Forecast

7.6 Worldwide MCM Market Forecast

7.7 Wafer Level Packaging

Companies Mentioned – Partial List

– ALLVIA

– AMD

– AMITEC

– AT&T

– Advanced Packaging Systems

– Aeroflex Laboratories

– Amkor

– Amkor Electronics

– Analog Devices

– Conexant

– Control Data

– Cubic Wafer

– David Sarnoff Research Center

– Delco Electronics

– Digital Equipment

– ERIM

– Elpaq

– Elpida – NXP

– STATS ChipPAC

– STMicroelectronics

– Samsung

– Samsung Electronics

– Sensonix

– Sharp

– Sharp

– Sheldahl

– Shinko

– Silex Microsystems

– Skyworks Solutions

– Spansion

– Spectra

– Thomson Consumer Electronics

– Toshiba

For more information visit http://www.researchandmarkets.com/research/c6m9jj/highdensity.

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
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