MRO Magazine

Research and Markets: Flip Chip/WLP Manufacturing and Market Analysis Study 2015


September 1, 2015
By Business Wire News

DUBLIN

Research and Markets (http://www.researchandmarkets.com/research/slmhpv/flip_chipwlp) has announced the addition of the “Flip Chip/WLP Manufacturing and Market Analysis” report to their offering.

Flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computer peripherals. Wafer-level packaging (WLP), the fabrication of the package directly on the wafer, is experiencing exceptional growth and stands out as one of the bright growth areas in electronics today.

WLP offers lower cost, a smaller package, higher performance and added functionality compared to older methods. In the world of high-speed/high-performance IC and package design, flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computing.

This report examines the market for flip chip ICs, and the lithography and wet etch tools used in their manufacture.

Key Topics Covered:

Chapter 1 Introduction

Chapter 2 Executive Summary

Chapter 3 Flip Chip/WLP Issues and Trends

3.1 Introduction

3.2 Wafer Bumping

3.3 Wafer Level Packaging

3.4 Pad Redistribution

3.5 Wafer Bumping Costs

Chapter 4 Lithography Issues And Trends

4.1 Issues

4.2 Exposure Systems

4.3 Competitive Technologies

Chapter 5 UBM Etch Issues And Trends

5.1 Introduction

5.2 Technology Issues And Trends

5.3 Batch Versus Single-Wafer Etching

Chapter 6 Metallization Issues and Trends

6.1 Introduction

6.2 Sputtering Metallization

Chapter 7 Market Analysis

7.1 Market Drivers For Flip Chip And WLP

7.2 Market Opportunities

7.3 Challenges

7.4 Flip Chip Market

7.5 Lithography Market

7.6 Wet Etch Market

7.7 Deposition Market

For more information visit http://www.researchandmarkets.com/research/slmhpv/flip_chipwlp

Research and Markets
Laura Wood, Senior Manager
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