MRO Magazine

Opportunities in the High Temperature Adhesives Market – Global Trends, Forecasts and Opportunity Analysis 2016-2021 – Research and Markets


May 13, 2016
By Business Wire News

DUBLIN

Research and Markets has announced the addition of the “Opportunities for the Global High Temperature Adhesives Market 2016-2021: Trends, Forecasts and Opportunity Analysis” report to their offering.

The global high temperature adhesives market is forecast to grow at a CAGR of 4% from 2016 to 2021

The major growth drivers for this market are the growth in electrical and electronics industry, and increasing automotive production. The printed circuit board (PCBs) makes the use of high temperature adhesives in the bonding of surface mount-components, wire tacking, and potting and encapsulating electronic components.

Within the high temperature adhesives market, the electrical and electronics segment is expected to remain the largest segment by value and volume consumption. Growing demand for PCBs from telecommunication, computer/peripherals, consumer, and microelectronic assembly applications, miniaturization of IC chips, and a rapid move towards smaller and higher-performance electronic devices is expected to spur growth for this segment over the forecast period.

Asia Pacific is expected to remain the largest market due to an increase in the production of printed circuit board in China, Taiwan, Japan, and South Korea and the use of high temperature adhesives in the assembly and packaging of electronic circuits.

North America and Rest of the World are expected to witness significant growth over the forecast period due to new technological developments will be explored by high temperature adhesive manufacturers to meet consumers’ demand.

For market expansion, the report suggests innovation and new product development, where the unique features of high temperature adhesives can be capitalized. The report further suggests the development of partnerships with customers to create win-win situations and the development of low-cost solutions for end users.

Emerging trends, which have a direct impact on the dynamics of the market, includes the new silicone-based electrically conductive adhesives in automotive sensor applications, development of fast cure and high temperature resistant adhesives, and replacement of lead solder with electrically conductive adhesives. Henkel AG & Co KGaA, 3M Company, Avery Dennison Corporation, Master Bond Inc., and Permabond are among the major suppliers of high temperature adhesives. There are some companies that are opting for merger & acquisition as strategic initiatives for driving growth.

Scope of the Report

By application type [Volume (Million Pounds) and $ Million shipment from 2010 to 2021]:

– Electrical and electronics

– Automotive

– Aerospace

– Others (Marine and Construction)

By polymer type [Volume (Million Pounds) and $ Million shipment from 2010 to 2021]:

– Epoxy based high temperature adhesive

– Silicone based high temperature adhesive

– Acrylic based high temperature adhesive

– Other high temperature adhesive (Polyamide and polyolefin)

By technology type [$ Million shipment from 2010 to 2021]:

– Reactive

– Solvent based

– Hot Melt

– Film

By product form [$ Million shipment for 2015]:

– Paste

– Liquid

– Film

Companies Mentioned

– 3M Company

– Avery Dennison Corporation

– Henkel AG & Co KGaA

– Master Bond Inc.

– Permabond

For more information visit http://www.researchandmarkets.com/research/w4k9t9/opportunities_for

Research and Markets
Laura Wood, Senior Manager
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Sector: Advanced Materials, Adhesives and Sealants