MRO Magazine

Global Thermal Interface Materials Market Report 2016-2026 – Analysis, Technologies & Forecasts – Key Vendors: Denka, GrafTech, Henkel – Research and Markets


June 27, 2016
By Business Wire News

DUBLIN

Research and Markets has announced the addition of the “Thermal Interface Materials 2016-2026: Status, Opportunities, Market Forecasts” report to their offering.

The contact area between high power, heat generating components and heat sinks can be as low as 3%, due to the micro-scale surface roughness. Thermal interface materials are required to enhance the contact between the surfaces, and decrease thermal interfacial resistance, and increase heat conduction across the interface.

Proper selection of Thermal Interface Materials (TIM) is crucial for the device efficiency. Instead of sophisticated cooling technique, it is often better to invest in the interface material. Without good thermal contact, the use of expensive thermally conducting materials for the components is a waste.

The state of the market in 2016, a geographic breakdown of the market, and forecasts to 2026, are separated by TIM type and by application. These have been compiled after an extensive interview program with thermal interface material manufacturers making a variety of materials, and many different applications, and using financial data published by public companies. Thermal Interface Materials 2016-2026 includes profiles of 31 companies working in this industry.

Companies Mentioned:

  • 3M Electronic Materials
  • AI Technology
  • AIM Specialty Materials
  • AOS Thermal
  • DK Thermal
  • Denka
  • Dow Corning
  • Dymax Corporation
  • Ellsworth Adhesives
  • Enerdyne
  • European Thermodynamics Ltd
  • Fralock
  • Fujipoly
  • GrafTech
  • Henkel
  • Honeywell
  • Indium Corporation
  • Inkron
  • Kitagawa Industries
  • LORD
  • Laird Tech
  • MA Electronics
  • MH&W International
  • Minteq
  • Momentive
  • Parker Chomerics
  • Resinlab
  • Schlegel Electronics Materials
  • ShinEtsu
  • Timtronics
  • Universal Science

Report Structure:

1. EXECUTIVE SUMMARY

2. INTRODUCTION

3. DRIVERS

4. CHARACTERISING TIMS

5. TYPES OF THERMAL INTERFACE MATERIAL

6. BENCHMARKING OF THERMAL INTERFACE MATERIALS

7. RELATED TECHNOLOGIES

8. EMERGING MATERIALS AND DISRUPTIVE TECHNOLOGIES

9. MARKETS

10. EMERGING APPLICATIONS

11. PATENTS AND PUBLICATIONS

12. VALUE CHAINS

13. STATE OF THE MARKET IN 2016

14. FORECAST 2016-2026

15. LIMITATIONS, RESTRAINTS AND THREATS

16. THE WINNERS WILL ADDRESS…

17. COMPANY PROFILES

For more information visit http://www.researchandmarkets.com/research/dgq6md/thermal_interface

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
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