MRO Magazine

Global 3D-Printed Metals Market Report 2016-2020 – Analysis, Technologies & Forecasts – Key Vendors: Alstom, Arcam, EOS – Research and Markets


May 11, 2016
By Business Wire News

DUBLIN

Research and Markets has announced the addition of the “3D-Printed Metals: A Patent Landscape Analysis – 2016 “ report to their offering.

Metals-based 3D printing is one of the fastest growing sectors of the 3D printing business. The author has already published widely on the growing market opportunities available in this space. Building on our extensive knowledge and understanding of this area we are now offering a report on the patent landscape presented by 3D-printed metals.

This report is based on an extensive search of relevant patents and patent applications published after December 1, 1995 from the US and WO patent databases to identify a broad, yet relevant patent landscape related to metal powder materials used for 3D printing. The report presents the quantitative patent landscape, which is essential to identifying the players, technologies, patent filing velocity, geographic distribution, and technology classifications in the 3DP metals area.

This report – which is the only one of its kind — covers both process and materials patents and answers such vital questions as:

  • What patents have been granted and what patent applications have been filed?
  • How many patents are being filed each year?
  • Who are the most significant inventors, researchers and companies active in the field
  • Which companies are making the earliest patent grants?
  • What patent families are already claimed and where are the gaps in the IP landscape where new IP rights may be available?
  • What is the geographic distribution and technological class distribution of these patents?

Companies Mentioned:

  • Alstom
  • Arcam
  • ConforMIS
  • EOS
  • General Electric
  • Honeywell
  • Husky Injection Molding
  • Materialise NV
  • Panasonic/Matsushita
  • Siemens
  • The ExOne Company
  • United Technologies Corporation

Report Structure:

Chapter One: Research Findings and Summary

Chapter Two: Active Universities

Chapter Three: Key Inventors

Chapter Four: Patent Trend

Chapter Five: Key Patents Based on Forward Citation

Chapter Six: Technology Analysis

Chapter Seven: Geographical Distribution

Chapter Eight: Granular Analysis

Chapter Nine: White Space Analysis

Chapter Ten: Commentary and Guidance

For more information visit http://www.researchandmarkets.com/research/hbfq76/3dprinted

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
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