Emergence of COB Technology Will Significantly Augment the Global LED Packaging Equipment Market Until 2020, Says Technavio
By Business Wire News
By Business Wire News
According to the latest research study released by Technavio, the global light emitting diode (LED) packaging equipment market is expected to reach over USD 656 million in revenue by 2020.
This research report titled ‘Global LED Packaging Equipment Market 2016-2020’, provides an in-depth analysis of market growth in terms of revenue and emerging market trends. This market research report also includes up to date analysis and forecasts for various process segments, including LED testing, die singulation, die attach, substrate separation, and permanent bonding.
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“COB is a type of bare chip technology used for LED lighting. The lighting module for a COB LED is done by placing multiple LED chips in a small area. It is a comparatively new technology for LED packaging, and it involves multiple LED chips being mounted directly on the substrate to make an LED array in one lighting module,” said Navin Rajendra, one of Technavio industry managers for sensors.
Global LED packaging equipment market by process 2015
Source: Technavio research
The segment was valued at USD 124.7 million in 2015. Die singulation, which is also known as wafer dicing, is used to separate individual dies on the finished wafer for further packaging and assembly. This process is carried out based on the end application of the LED. For instance, different types of dies are used in general lighting systems than in automotive applications.
The size of dies, type of structure, and nature and type of substrates decide the singulation technique to be applied. The cost and performance parameters are also taken into consideration. The evolution of new laser technologies for dicing and scribing purposes will create the need for equipment and will also help die singulation maintain its market share in the global LED packaging equipment market.
The success of a finished product depends on many key processes that achieve their individual quality goals and targets. Die attach is a key process in LED manufacturing. It involves the attachment or bonding of a die (also known as a chip) to an LED package. Some of the requirements for the die attach process are:
- Thermal conductivity should dissipate the heat generated from the die.
- Perfect contact should be there between the chip and substrate without any voids.
- The bond or attachment should be made very carefully so that it does not destroy the die or chip.
- The bond or attachment should be able to withstand extreme temperatures without any degradation.
The size of wafers that are used for the production of LED chips has increased from 2-4 inches to 6-8 inches. The large wafer size allows manufacturers to reduce the overall cost by producing more LED chips per wafer. Intensifying price wars have compelled manufacturers to emphasize cost reduction and a shift toward large-diameter wafers for LED production.
The segment was valued at USD 25.45 million in 2015. Substrate separation is a vital process in the packaging of LED chips. In order to maintain manufacturing efficiency, LED manufacturers typically attach or populate multiple LED boards, with the boards being tied together. After this, a punching tool or a manual breaking process is used to separate the LED boards. The manufacturers need to be careful during the process as the printed circuit board can easily bend or flex due to excessive stress on the ceramic substrate and the LEDs soldered onto the substrate. The excessive stress may also result in a crack, thereby creating defective LEDs.
Browse related reports:
- Global Automotive LED Lighting Market 2016-2020
- Global LED Industrial Lighting Market 2016-2020
- Global LED Production Equipment Market 2015-2019
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