MRO Magazine

Efficient Power Conversion EPC2040 Technology and Cost Comparison Report – Research and Markets


May 16, 2016
By Business Wire News

DUBLIN

Research and Markets has announced the addition of the “Efficient Power Conversion EPC2040: Technology and Cost Comparison” report to their offering.

The EPC2040 is a 15V eGaN FET© from Efficient Power Conversion for high frequency pulsed applications like LiDAR (Light Distancing and Ranging). The ability of EPC2040 to switch ten times faster than MOSFETs increases the resolution, response time and accuracy of capturing three dimensional LiDAR images.

The EPC2040 is a GaN-on-silicon HEMT (High Electron Mobility Transistor) designed by EPC, manufactured by Episil and supplied in passivated bare die form with solder balls. The wafer level package is well suited for high frequency functions with low inductive parasitic levels. WLCSP (Wafer Level Chip Scale Packaging) produces a small die, at just 0.85mm x 1.20mm, at low packaging cost.

The EPC2040 is manufactured with the latest EPC technology. The new gate structure reduces gate leakage and the metal contact has been enhanced. Moreover we observe a very thin epitaxy layer to reduce the cost.

The report presents deep technology analysis of the packaging and components with images of the complex GaN epitaxy layer stack and transistor structure.

It also includes production cost analysis and overall comparison with the first EPC GaN HEMT.

Key Topics Covered:

Overview / Introduction

Companies Profile

– EPC Profile

– Episil Profile

EPC2040 Characteristics

EPC2040 Physical Analysis

– Package

— Package Views & Dimensions

— Package Cross-Section

— Pad Cross-Section

– GaN transistor

— Die View, Dimensions & Marking

— Edge of the Die

— Metal Layers

— Gate Cross-Section

— Source Cross-Section

— Drain Cross-Section

— Substrate and Epitaxy Layers

– GaN Transistor Characteristics

Manufacturing Process Flow

– Global Overview

– GaN Transistor Front end Unit

– Transistor Process Flow

– Packaging Process Flow

Cost Analysis

– Synthesis of the cost analysis

– Main steps of economic analysis

– Yields Hypotheses

– Epitaxy Cost

– Front-End Cost

– Wafer Cost

– Wafer Cost per process steps

– Probe and Dicing Cost

– Packaging Cost

– Final Test Cost

– EPC2040 Component Cost

Price Estimation

Comparison of 3 EPC Transistors

For more information visit http://www.researchandmarkets.com/research/2r9c4k/efficient_power

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
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