MRO Magazine

ASE Water Recycling Plant Marks First Milestone

By Business Wire News   


Advanced Semiconductor Engineering, Inc. (TSE:2311) (NYSE:ASX) today announced that its water recycling plant at its Kaohsiung flagship facility has reached a significant milestone. The water recycling plant completed a pilot run from January 15, 2015 to April 15, 2015, and began full fledged operations by the end of April 2015. On October 23, 2015, at 9.30am Taiwan time, the water recycling plant recorded an accumulative output volume of 1 million metric tons of recycled water. This volume of recycled water is capable of filling up approximately 400 Olympic sized swimming pools.

This year, Taiwan experienced a critical lack of rainfall which had vastly reduced water levels at reservoirs and created a serious water shortage. To combat such challenges, semiconductor companies such as ASE have developed methods to save, reuse and recycle water. “In our efforts towards a more sustainable enterprise, greater focus on water recycling and usage has been the emphasis at ASE,” says KC Chou, Senior VP, ASE Kaohsiung. “We are also planning to open up the water recycling facility for educational visits and promote industry water conservation efforts to the public,” he added.

ASE invested about $25 million to complete Phase 1 of the recycling facility, which can process up to 20,000 metric tons of wastewater and recycle up to 10,000 metric tons per day. Since the operation of the water recycling facility, ASE’s various manufacturing plants at the Kaohsiung Nantze Processing Zone have diverted their wastewater to this centralized facility for processing. The facility employs a multi-stage water treatment system to remove suspended solids, COD (chemical oxygen demand) and other pollutants so that the effluents discharged meet prescribed Environment Protection Bureau (EPB) standards. The treated water goes through Ultra-filtration (UF) and Reverse Osmosis (RO). RO has been most commonly used to desalinate sea water in many countries to create potable water.

About the ASE Group

The ASE Group is the world’s largest provider of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through Universal Scientific Industrial Co., Ltd. and its subsidiaries, members of the ASE Group. The Group generated sales revenues of US$8.5 billion in 2014 and employs over 68,000 people worldwide. For more information about the ASE Group, visit

Safe Harbor Notice

This press release contains “forward-looking statements” within the meaning of Section 27A of the United States Securities Act of 1933, as amended, and Section 21E of the United States Securities Exchange Act of 1934, as amended, including statements regarding our future results of operations and business prospects. Although these forward-looking statements, which may include statements regarding our future results of operations, financial condition or business prospects, are based on our own information and information from other sources we believe to be reliable, you should not place undue reliance on these forward-looking statements, which apply only as of the date of this press release. The words “anticipate,” “believe,” “estimate,” “expect,” “intend,” “plan” and similar expressions, as they relate to us, are intended to identify these forward-looking statements in this press release. Our actual results of operations, financial condition or business prospects may differ materially from those expressed or implied in these forward-looking statements for a variety of reasons, including risks associated with cyclicality and market conditions in the semiconductor or electronic industry; changes in our regulatory environment, including our ability to comply with new or stricter environmental regulations and to resolve environmental liabilities; demand for the outsourced semiconductor packaging, testing and electronic manufacturing services we offer and for such outsourced services generally; the highly competitive semiconductor or manufacturing industry we are involved in; our ability to introduce new technologies in order to remain competitive; international business activities; our business strategy; our future expansion plans and capital expenditures; the strained relationship between the Republic of China and the People’s Republic of China; general economic and political conditions; the recent global economic crisis; possible disruptions in commercial activities caused by natural or human-induced disasters; fluctuations in foreign currency exchange rates; and other factors. For a discussion of these risks and other factors, please see the documents we file from time to time with the Securities and Exchange Commission, including our 2014 Annual Report on Form 20-F filed on March 18, 2015.

Patricia MacLeod, +1 408-636-9500
Jennifer Yuen, +65 6631 4229


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