MRO Magazine

ASE Announces Signing Ceremony With TDK on the Inauguration of ASE Embedded Electronics Incorporated

September 4, 2015
By Business Wire News


Advanced Semiconductor Engineering, Inc (TSE: 2311, NYSE: ASX) today announced the official inauguration of ASE Embedded Electronics Incorporated, at a formal signing ceremony in Kaohsiung with TDK Corporation and local officials.

On May 8th, 2015, both ASE and TDK entered into an agreement to establish a joint venture company, named ASE Embedded Electronics Incorporated, to manufacture IC embedded substrates using TDK’s SESUB®(Semiconductor Embedded in SUBstrate) technology. The ASE Embedded Electronics manufacturing facility is to be located in the Nantze Export Processing Zone, Kaohsiung City, Taiwan. ASE’s System-in-Package (SiP) solutions using SESUB technology will offer a robust embedded solution in enabling a wide number of applications such as PMIC, sensors, RF tuners, and many more. Through the joint venture company, ASE aims to leverage ASE’s capabilities in advanced packaging, test and module level solutions with TDK’s proven proprietary embedded technology to address escalating market needs for semiconductor miniaturization.

As a leader in SiP technology, ASE continues to expand its product and service portfolio through collaboration with key suppliers and partners. “Such alliances enable ASE to strengthen its SiP ecosystem and offer our customers a complete suite of solutions for integrating dozens of chips into smaller and thinner spaces in the advent of portable and wearable devices and the Internet of Things,” said Dr. Tien Wu, COO, ASE Group.

About the ASE Group

The ASE Group is the world’s largest provider of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through Universal Scientific Industrial Co., Ltd. and its subsidiaries, members of the ASE Group. The Group generated sales revenues of US$8.5 billion in 2014 and employs over 68,000 people worldwide. For more information about the ASE Group, visit

Safe Harbor Notice

This press release contains “forward-looking statements” within the meaning of Section 27A of the United States Securities Act of 1933, as amended, and Section 21E of the United States Securities Exchange Act of 1934, as amended, including statements regarding our future results of operations and business prospects. Although these forward-looking statements, which may include statements regarding our future results of operations, financial condition or business prospects, are based on our own information and information from other sources we believe to be reliable, you should not place undue reliance on these forward-looking statements, which apply only as of the date of this press release. The words “anticipate,” “believe,” “estimate,” “expect,” “intend,” “plan” and similar expressions, as they relate to us, are intended to identify these forward-looking statements in this press release. Our actual results of operations, financial condition or business prospects may differ materially from those expressed or implied in these forward-looking statements for a variety of reasons, including risks associated with cyclicality and market conditions in the semiconductor or electronic industry; changes in our regulatory environment, including our ability to comply with new or stricter environmental regulations and to resolve environmental liabilities; demand for the outsourced semiconductor packaging, testing and electronic manufacturing services we offer and for such outsourced services generally; the highly competitive semiconductor or manufacturing industry we are involved in; our ability to introduce new technologies in order to remain competitive; international business activities; our business strategy; our future expansion plans and capital expenditures; the strained relationship between the Republic of China and the People’s Republic of China; general economic and political conditions; the recent global economic crisis; possible disruptions in commercial activities caused by natural or human-induced disasters; fluctuations in foreign currency exchange rates; and other factors. For a discussion of these risks and other factors, please see the documents we file from time to time with the Securities and Exchange Commission, including our 2014 Annual Report on Form 20-F filed on March 18, 2015.

Patricia MacLeod, +1 408-636-9500
Jennifer Yuen, +65 6631 4229