Advanced IC Packaging Technologies, Materials and Markets, 2016-2020 – Research and Markets
May 30, 2016 | By Business Wire News
DUBLIN
Research and Markets has announced the addition of the “Advanced IC Packaging Technologies, Materials and Markets, 2016 Edition” report to their offering.
The demand for consumer electronics and mobile communications devices that keep us connected is driving electronics manufacturers to deliver ever-more compact and portable products. Today’s users ask for solutions that deliver more functionality, added performance, higher speed, and smaller form factors. Software systems and billions of networked devices are rapidly coalescing into a vast Internet of Things.
All of these forces are driving semiconductor companies to develop new advanced IC packaging technologies to provide greater silicon integration in increasingly miniaturized packages. The last decade has seen an explosion of new products including fan-out wafer-level packaging (FOWLPs), stacked IC packages and complex system-in-packages (SiPs), as well as advances in package substrates, flip chip interconnection and through silicon vias.
All these advances are enabling significant improvements in packaging density and opening new market opportunities for manufacturers. This latest report reveals the latest technology and market trends in the IC packaging industry by focusing on the most advanced packaging products and solutions-those critical to success in developing cutting-edge products and in maintaining technological leadership. Every market or application segment discussed in the report includes quantitative analysis based on the most current historical years, 2014 and 2015, as well as forecasts from 2016 through 2020. Each of the eight chapters covers a different topic and market segment.
Key Topics Covered:
Chapter 1: Introduction
Chapter 2: Executive Summary
Chapter 3: Overview of Worldwide IC Packaging Markets
3.1 IC Package Families
3.2 IC Packaging Market and Unit and Revenue Forecasts
3.3 Key Applications Market for IC Devices
Chapter 4: Advanced Single Chip IC Packaging
4.1 Overview of Advanced IC Packaging
4.2 Fan-Out Wafer Level Packages
4.3 Multi-Row QFN Packages
Chapter 5: Multichip Packaging Markets
5.1 Overview of Multichip Packaging Technology
5.2 MCP Market Trends and Forecasts
5.3 Stacked Multichip Packaging Market Segments
Chapter 6: System-in-Package Solutions & Substrate Materials
6.1 System-in-Packaging Market Overview
6.2 System-in-Packages Market Trends and Forecasts
6.3 Substrates
Chapter 7: Interconnection Technologies and Solutions
7.1 Interconnection Techniques Overview
7.2 Wire Bonding
7.3 Tape Automated Bonding
7.4 Flip Chip
7.5 Through-SiliconVias
7.6 Quilt Packaging
7.7 Panel Level Packaging
Chapter 8: Advanced IC Packaging Company Profiles
– 3D Plus, Inc.
– Advanced Semiconductor Engineering, Inc.
– Amkor Technology, Inc.
– Carsem, Inc.
– ChipMOS Technologies (Bermuda), Ltd.
– CONNECTEC Japan Corporation
– Deca Technologies
– FlipChip International, LLC
– HANA Micron Co., Ltd.
– Interconnect Systems Inc. (ISI)
– NANIUM, S.A.
– Palomar Technologies
– Powertech Technology, Inc.
– Shinko Electric Industries Co, Ltd
– Signetics Corporation
– Siliconware Precision Industries Co.
– SPEL Semiconductor, Ltd.
– STATS ChipPAC, Ltd
– United Test and Assembly Center, Ltd.
– Xintec, Inc.
For more information visit http://www.researchandmarkets.com/research/w9qzmp/advanced_ic
View source version on businesswire.com: http://www.businesswire.com/news/home/20160530005152/en/
Research and Markets
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