Research and Markets: High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends 2015
May 6, 2015 | By Business Wire News
DUBLIN
Research and Markets (http://www.researchandmarkets.com/research/c6m9jj/highdensity) has announced the addition of the “High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends” report to their offering.
High-density packaging offer a host of benefits including performance improvements such as shorter interconnect lengths between die, resulting in reduced time of flight, lower power supply inductance, lower capacitance loading, less cross talk and lower off-chip driver power.
This report examines and projects the technologies involved, their likely developments, what problems and choices are facing users, and where the opportunities and pitfalls are.
Key Topics Covered:
Chapter 1 Introduction
Chapter 2 Executive Summary
2.1 Summary of Technology Issues
2.2 Summary of Market Forecasts
Chapter 3 Technology Issues and Trends
3.1 Overview of HDP Technology
3.2 Technical Constraints of Integration
3.3 Economic Benefits of HDP
3.4 Technology Issues
3.5 3-D Modules
3.6 Superconducting Interconnects
3.7 Known Good Die
3.8 System In Package (SIP)
3.9 Multichip Package
3.10 Package-On-Package (PoP)
Chapter 4 Applications
4.1 Overview of HDP Applications
4.2 Military and Aerospace
4.3 Computer and Peripheral Equipment
4.4 Communications
4.5 Consumer
4.6 Industrial
Chapter 5 Competitive Environment
5.1 Overview of the HDP Competitive Environment
5.2 Joint Ventures and Cooperative Agreements
5.3 HDP Manufacturers
Chapter 6 3-D-TSV Technology
6.1 Driving Forces In 3D-TSV
6.2 3-D Package Varieties
6.3 TSV Processes
6.4 Critical Processing Technologies
6.5 Applications
6.6 Limitations Of 3-D Packaging Technology
6.7 Company Profiles
Chapter 7 Market Forecast
7.1 Overview of Multichip Modules
7.2 Driving Forces
7.3 Alternative Packaging Technologies
7.4 Worldwide IC Market Forecast
7.5 Worldwide Packaging Market Forecast
7.6 Worldwide MCM Market Forecast
7.7 Wafer Level Packaging
Companies Mentioned – Partial List
– ALLVIA
– AMD
– AMITEC
– AT&T
– Advanced Packaging Systems
– Aeroflex Laboratories
– Amkor
– Amkor Electronics
– Analog Devices
– Conexant
– Control Data
– Cubic Wafer
– David Sarnoff Research Center
– Delco Electronics
– Digital Equipment
– ERIM
– Elpaq
– Elpida – NXP
– STATS ChipPAC
– STMicroelectronics
– Samsung
– Samsung Electronics
– Sensonix
– Sharp
– Sharp
– Sheldahl
– Shinko
– Silex Microsystems
– Skyworks Solutions
– Spansion
– Spectra
– Thomson Consumer Electronics
– Toshiba
For more information visit http://www.researchandmarkets.com/research/c6m9jj/highdensity.
Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
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