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Micro circuits to support the ‘Internet of Things’

Waterloo, ON -- Terepac Corp., a pioneer in the world's tiniest digital electronics, and Rockwell Automation have engaged so Terepac can produce large volumes of its micro circuits for the ‘Internet of Things’ -- uniquely...


Waterloo, ON — Terepac Corp., a pioneer in the world’s tiniest digital electronics, and Rockwell Automation have engaged so Terepac can produce large volumes of its micro circuits for the ‘Internet of Things’ — uniquely identifiable objects and their virtual representations in an Internet-like structure that requires radio frequency identification (RFID) as a prerequisite.

Based on the agreement, Rockwell Automation will support the infrastructure that Terepac uses for its proprietary process, enabling it to miniaturize significantly more circuits than its current capability.

“Advanced manufacturing technology is rapidly transforming the global competitive landscape, and Terepac is using its unique technology to produce very small circuits,” said Sujeet Chand, senior vice-president and chief technology officer, Rockwell Automation. “We have a unique opportunity to help Terepac scale its breakthrough technology and advance microelectronics to the next level.”

“We’re pleased to work with Rockwell Automation’s highly qualified team because they’re a world leader in the delivery of industrial automation solutions,” said Terepac CEO Ric Asselstine. “They share our goal to create extraordinary technology to give people everywhere more useful information about the world around them.”

In April Terepac announced the TereTag, which allows virtually any object to become part of the “Internet of Things”. The tag, embedded unobtrusively in its host, provides a wide range of capabilities to identify, communicate, and operate with more security and efficiency.

“Giving an electronic voice to an almost limitless number and type of objects can result in unpredecented gains in efficiency, insight and organizational change,” said Asselstine. “From health conditions to energy efficiency to more optimized industrial processes, we are learning the potential advances made possible by applying this technology. We are delighted to have Rockwell Automation work with us.”

Terepac Corporation, a pioneer in the burgeoning Internet of Things, has developed a breakthrough semiconductor packaging and assembly method to allow effective handling and packaging of the tiniest imaginable chips, objects and electronic components – at its limit to the nanometer scale. As a result, sophisticated microelectronics can be printed on flexible substrates at a fraction of the size and cost of conventional methods. Entire structures with microprocessors, memory and sensors can be reduced to less than a millimeter square, thinner than paper, and flexible enough to bend around a pencil – with no sacrifice in performance.

Terepac makes it possible to significantly reduce the size and weight of electronics in existing devices, and to introduce electronics into or onto devices where previously not thought possible. The result is a new category of electronics that “gives voice to the world” thereby creating a novel window in to object condition and behaviour and an entirely new source of managed and visualized “big data.”

Terepac Corporation is privately held with headquarters in Waterloo, ON. For more information, please visit www.terepac.com.

Rockwell Automation Inc., the world’s largest company dedicated to industrial automation and information, is headquartered in Milwaukee, WI.